1: Own and drive new product development on time to RTM with uncompromising quality
2: New product characterization and datasheet making
3: Lead NPI activities for transfer/backup wafers and scheduling
4: Co-work with package R&D group to qualify and evaluate new packages
5: Co-work new wafer platform development and qualification
6: Co-work worldwide product characterization and analysis from different groups (MKT, FAE…)
7: Define and maintain product datasheet, CP and FT spec with accuracy
8: Set-up new test equipment and methodology to improve the product characterization
9: Set-up and improve testing SOP/guild line
10: Maintain product engineering database and improve traceability/data of new product/package
11: Train new product engineer and technician
12: To accomplish other tasks assigned by supervisors in a timely manner
       13: Propose qualification plan for new product / process change based on his/her understanding of the interaction between packaging process, fab process and silicon design