The Failure Analysis Engineer determines the root cause of IC failure by using analog semiconductor IC related knowledge and technology and combining with professional FA techniques. Once the failure root cause has been identified, the Failure Analysis Engineer works with the related R&D team to solve the issue to improve IC quality and mass production smoothly.
FA运用专业的失效分析技术和半导体相关的知识会诊芯片研发和制程中的IC失效根源，一旦确定失效原因，与其他研发团队共同合作解决芯片Bug，提升芯片品质和确保量产。
Responsibilities岗位职责:  
·           Support R&D (New Design/Process/Package development) 支持研发（新产品设计/流程/封装工艺提升）
·           Support Internal Products yield enhancement 支持内部产品良率改进
·           Customer’s failure analysis 客户产品失效分析
Requirements岗位要求:
·           Master degree or equivalent (Semiconductor and micro-electronics Tech) 硕士及同等学历（半导体及微电子技术专业）
·           Good knowledge of analog circuit, device, semiconductor IC manufacture process, etc.良好的模拟电路，器件，模拟集成电路制造流程等知识
·           Strong in analytical and communication (both verbal and written English) skills分析能力及沟通能力强（英语口语及书面表达良好）
·           Self-motivated, responsibility, goal-oriented and able to work in a team environment自我激励，有责任感，目标导向，并且注重团队合作