Key Job Responsibilities:
A.Design Technology Platform for HPC/AI/Network/Storage

1. Identify technology trend, market requirements and the required technical solutions:
2. Physical design
3. Chiplet solution
4. IP subsystem
5. Advanced packaging: CoWoS, InFO, 3DIC, etc.
6. Manufacturing engineering (post-gds2)
7. Work with internal teams to ensure the delivery of technical solutions in technology roadmap
8. Local technology liaison with TSMC China FTS Team (process technology and advanced package roadmap) (non-commercial tasks only)
9. Attend various local technical conferences in China and summarize key take-aways for ENG/RD teams.
10. Host regular meetings with China AM and TPM teams to update design technology platform status

1. Develop key IP strategy to enable HPC ASIC leadership position in China
2. PCIe5, DDR5, 112G PAM4 serdes, HBM2E/3, D2D, etc.
3. Develop Internal IP subsystem service strategy

1. C. China Biz Development and Market Analysis reports:
2. Compute
3. Compute Acceleration
4. Networking
5. Datacenter Interconnect
6. Storage
7. Other high growth segments

• D. MARCOM

1. Responsible for MARCOM activity in China (TSMC, SNPS, CDNS, RISC-V, ARM, etc. events )
2. Responsible for content development for Wechat 公眾號
3. Responsible for China company profile update/upgrade
4. Provide promotion material per each of major ASIC service functions optimized for China: FE Design, IP Subsystem, Physical Design, Advanced Package and Test, Manufacturing, etc.

1. Master degree or above
2. ASIC design experience
3. ASIC marketing and/or sales experience
4. Experience with TSMC foundry process technology
5. Experience with IP integration and/or sales
6. Experience with 2.5D package design and/or engagement