20万 - 26万 苏州 | 5年以上 | 本科及以上 | 全职
职位福利:年终奖金,五险一金,福利好,老板nice,年底双薪,年度旅游,技术领先,交通补助,技能培训
发布时间:2020-10-22 发布者：王玥丹 投递简历
岗位职责:
Required knowledge, skills, abilities:
1. ISO9001 & IATF16949 plus VDA6.3
2. MSA, SPC, FMEA, APQP, PPAP
3. Sampling plan (MIL-STD-105E & MIL-STD-1916)
4. 8D methodology of problem analysis& solving (Is-Is Not, Ishikawa C&E Diagram & Verifications, 5-Way, Fault tree analysis . . . )
5. 6S, RoHS, ESD
6. Operation of chip probing, IC package assembly & final testing
7. 6Sigma(DMAIC) knowledge
8. Emotional quotient plus communication/negotiation/integration (情緒管理與溝通協調整合)
Required education and experience
1. College or Bachelor above. 工業工程與管理及理工相關科系
2. Experienced in semiconductor IC assembly process, quality control, manufacturing for 5 years.
