Job Descripton:
1. Coordinate with PM, product, testing,packaging,reliability and backend team during prototyping and production stages for achieving delivery target.
2. Support Sales/CS to be a good bridge between customer requirements and ASIC manufacturing supports.
3. WAT,CP and FT data monitoring, yield analysis, maintain, and improvement.

Job Requirements:
Education:
1) Bachelor degree of the science and engineering related major.
Working Experience:
1) Over 5-year experience in semiconductor industries specialized in Device, Product,Testing and Package Engineering.
2) Familiar with Tape-out procedure, CMOS device, and IC process.
3) Familiar with yield analysis, yield improvement, and failure analysis.
4) Familiar with characterization and component qualification.
5) With the experiences to co-work with test and design teams to define MP testing spec.

Professional Knowledge:
1) Fab process knowledge.
2) Testing related knowledge.
3) Package and assembly related knowledge.
4) Fluent in English writing, reading, and oral communication.

Other Special Requirement:
1) Good coordination, communication skill
2) Proactive, team work