-Work with both fab and internal teams to handle product yield& reliability issues and strive for continuous improvement.
与晶圆厂及内部团队合作，处理产品良率与可靠性相关问题并持续改进。
-Support design enables in product development phase, including problem solving for circuitry simulation, device operation, reliability assurance, layout, tape out, etc.
在产品开发阶段支持设计实现，包括解决电路仿真、器件使用、可靠性、版图、设计定案等方面的问题。
-Track emerging technologies, like MRAM/RRAM, for AI and big data applications.
跟踪人工智能与大数据相关新兴技术，包括磁阻式随机存取存储器/阻变存储器等。