-Package design feasibility study to provide the more competitive package solution; Co-work with R&D team to optimize and generate the Bump map and Ball map.
评估芯片封装的可行性，为产品设计提供有竞争力的封装方案. 从封装设计的角度优化die pad以及ball map.
-Responsible for completing package designs; review the design files with subcon and substrate vendor; generate the package simulation model.
能够独立完成芯片封装设计；协同封装厂与基板厂审核设计方案.；生成封装设计仿真模型

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