Duties and Responsibilities

• Lead the equipment performance improvement project.
• In charge of new machine purchasing spec definition, setup, buyoff and involved into tooling design.
• Lead the Equipment OEE/MTBA/MTBF/Cost saving project
• Draft equipment related SPEC, WI, EFMEA document
• Work with other department to improve equipment related quality, yield and output
• Support customer complaint on root cause finding and actions implementation.
• Deliver training to technician and operator
• Support automation projects through design concept review, progress monitoring and timeline control.
• Other tasks assigned by reporting managers
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  Qualifications
• Solder die attach process / SMT equipment engineering background with at least 8 years working experience.
• Familiar with ESEC solder DA / Yamaha SMT/Printer machine.
• Knowledge and experience on Yamaha SMT, Vadu Reflow machines or other equivalent platforms
• Have deep understanding and hands-on experience of surface-mount technology (SMT)material, tooling equipment and their interaction
• Be good at CAD / PLC / VISION / IPC / Automation technology
• Fluent English with CET 4 and above.
• Positive, self-motivated, open-minded, can work under high pressure.
• Be able to write good technical/engineering report
• Strong team communication and team work skill.